ELECTRONICS MANUFACTURING SERVICES · ISTANBUL
From electronic design support to PCB, stencil and component sourcing—and from SMD/THT assembly to delivery—we coordinate the manufacturing steps your project requires.
SERVICES · 01
A single production operation or a coordinated scope including sourcing: the service model is defined by the status of your project files and materials.
Engineering support for translating product requirements into schematics, PCB layout, embedded software and manufacturing files.
Managing the sourcing of printed circuit boards and solder-paste stencils according to board specifications and manufacturing data.
Sourcing the electronic components defined in the BOM according to project quantity and production planning.
Placement and soldering of surface-mount components on the PCB according to manufacturing documentation.
Assembly of through-hole components, connectors and mechanical parts according to board requirements.
PRODUCTION FLOW · 02
Each project is evaluated through its technical data, material scope, target quantity and delivery expectations. The production plan is built around these inputs.
Product requirements, target quantity, available BOM/Gerber files and delivery expectations are reviewed together.
We define which PCBs, stencils and components will be sourced by BESEM for the project.
Approved data, boards, stencils and components are consolidated into a production-ready set.
Components are placed according to manufacturing data and the relevant soldering processes are applied.
Manufactured boards pass the controls defined within the project scope and are prepared for delivery.
ENGAGEMENT MODELS · 03
The service scope is defined by the readiness of your technical data and by whether PCBs and components are sourced by BESEM or supplied by the customer.
Engineering support from product requirements through circuit, PCB and manufacturing data preparation.
Direct sourcing and production planning for projects with completed BOM, Gerber and assembly data.
PCB, stencil and component sourcing managed together with the assembly process under one project scope.
SMD/THT assembly using PCBs and components supplied by the customer.
THE BESEM APPROACH · 04
BESEM Electronics evaluates every project according to its manufacturing files, target quantity, material status and delivery expectations. Our aim is to define the required service scope from the outset and provide a single point of contact from design through delivery.
TECHNICAL FAQ · 05
Concise answers that help define the data, material and production scope before quotation.
For a production-ready project, the main inputs are the BOM, Gerber files and, where available, pick-and-place data. Board specifications, target quantity and delivery expectations should also be provided for technical review.
SMD components are mounted directly on the PCB surface, while leaded THT components are inserted through holes in the board. Both assembly methods can be used on the same PCB.
Yes. Depending on project scope, PCB, stencil and BOM-defined component sourcing can be coordinated together with assembly. The exact scope is confirmed during quotation based on file and material readiness.
You can start the technical review by identifying the missing files during the initial discussion. Any required design or manufacturing-data support is scoped separately according to the current state of the project.
REQUEST FOR QUOTATION · 06
Send your BOM, Gerber and pick-and-place files, if available, together with the target quantity and delivery expectation. Please indicate any missing data or design-support requirement during the initial discussion.
Dereağzı District, Serinpınar Ave., Haydarpaşa St. No:6/5, Beylikdüzü / Istanbul
Monday–Friday · 09:00–18:00
